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3D Heterogeneous technologies for Digital secured & sovereign solutions


Keywords: 2.5/3D integration, integrated circuit, hardware security

Abstract: Digital ASICs are heavily impacted by intrusion attempts, carried out by software and/or hardware attacks. Ensuring their resilience is critical for sovereign ASICs or solutions dedicated for the automotive market.

The advent of heterogeneous 2.5D/3D technologies offers an opportunity in the construction of secure circuits, by allowing the development and use of a secure hardware, which can accommodate an assembly of chips from various origins, while guaranteeing the secure operation of the whole system.


Thesis director: Giorgio DI NATALE (TIMA - AMfoRS)
Thesis started on: Oct. 2022
Doctoral school: EEATS

Submitted on October 26, 2022

Updated on December 12, 2023