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Variance Analysis in 3D Integration: A Statistically Unified Model with Distance Correlations

Auteur(s) : A. Ayres, O. Rozeau, B. Borot, L. Fesquet, P. Batude, M. Vinet

Journal : IEEE Transactions on Electron Devices

Volume : 66

Issue : 1

Pages : 633-640

Doi : 10.1109/TED.2018.2879680