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Global modeling and simulation of System-on-Chip embedding MEMS devices

Auteur(s) : Z. Juneidi, K. Torki, S. Martinez, G. Nicolescu, B. Courtois, A. A. Jerraya

Doc. Source: 4th International Conference on ASIC (ASICON'01)

Publisher : IEEE

Pages : 666-669

Doi : 10.1109/ICASIC.2001.982651

Systems-on-Chip (SoC) and Systems-on-Package (SoP) are becoming more and more heterogeneous systems. In order to validate systems containing such a variety of components, global multi-domain simulation of different aspects becomes especially important. Hardware/software, analog/digital, and electronic/mechanical/optic mixed simulations must be accessible. This paper presents a methodology to establish an environment for the global modeling and simulation of system-on-chip embedding MEMS devices. This methodology is illustrated in two co-simulation frameworks: the optical cross-connect co-simulation framework and the electro-thermal co-simulation framework.