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Through-Silicon-Via Built-In Self-Repair for Aggressive 3D Integration

Auteur(s) : M. Nicolaidis, V. Pasca, L. Anghel

Doc. Source: International On-Line Testing Symposium (IOLTS’12)

Publisher : IEEE

Pages : 91-96

Doi : 10.1109/IOLTS.2012.6313847

Three-dimensional (3D) integration by die-/wafer-level stacking becomes a reality, as Through-Silicon-Via technologies emerge. However, poor reliability and yield of TSV interconnects remain major challenges of this promising technology. In this paper, we propose an efficient Built-In Self-Repair (TSV-BISR) strategy for TSV faults due to manufacturing and aging defects. After interconnect tests, we replace faulty TSVs with fault-free spares using shift operations. Among the benefits of this solution is that the self-repair signals are determined on-chip without any external intervention. Moreover, we show that with TSV-BISR better reparability is achieved with fewer spares than in existing TSV repair techniques. We also show that for 3D chips with interconnect reparability targets above 98% we reduce the area needed for spares and repair logic by up to 40%.