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Physical Implementation of an Asynchronous 3D-NoC Router Using Serial Vertical Links

Auteur(s) : F. Darve, H. Sheibanyrad, P. Vivet, F. Pétrot

Doc. Source: IEEE Computer Society Annual Symposium on VLSI (ISVLSI'11)

Publisher : IEEE

Pages : 25 - 30

Doi : 10.1109/ISVLSI.2011.59

This paper details the design and implementation of an asynchronous 3D-NoC router using a novel serialization scheme in the vertical directions which targets 3D production oriented processes. A study of the router cost has been conducted for medium and high density TSVs on 65nm and 32nm nodes. A router integrating the serial link has been implemented in 65nm using medium density TSVs. The serial link provides a throughput of 16 Gb/s for an area gain of 57%, and an additional cost of one NoC routing hop in latency and in energy.