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Electromigration Behavior of 3D-IC TSV

Auteur(s) : T. Frank, C. Chappaz, P. Leduc, L. Arnaud, S. Moreau, A. Thuaire, F. Lorut, L. Anghel

Doc. Source: Second IEEE International Workshop on Testing Three-Dimensional Stacked Integrated Circuits (3D IC'11), in conjuction with ITC