< retour aux séminaires

Prof. P.R. MUKUND, Rochester Institute of Technology

Theme: Chip-Package Co-Design of RF Microsystems
Date: Lundi 13 octobre 2003, INPG, Salle de réunion du rez-de-chaussée du Bâtiment P


The design of systems that contain both RF circuitry and digital circuitry, either in a single integrated circuit or a single package, poses challenges that are difficult to overcome with traditional design tools. For an efficient design methodology, it is imperative that an early design component be incorporated into the design cycle. Further, the chip and the package have to be designed concurrently. In this talk, a chip package co-design methodology and a resultant software tool will be presented. This research was sponsored by the National Science Foundation and the Semiconductor Corporation.