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Prof. William R. Eisenstadt, University of Florida

Theme: High Performance I/O Circuit Design
Date: March 8th 2012 - 11:00, TIMA Laboratory, room T312

Biography

William R. Eisenstadt (SM’92) received the B.S., M.S., and Ph.D. degrees in Electrical Engineering from Stanford University, Stanford, CA, in 1979, 1981, and 1986. In 1984, he joined the faculty of the University of Florida, Gainesville, FL, where he is now a Professor. His research focuses on mixed-signal/RF embedded IC testing, high-speed I/O characterization, BIST, and differential s-parameter characterization of integrated circuit devices, packages, and interconnect. He was Technical Program Co-Chair of the 7th, 6th 5th and 4th Workshops on Test of Wireless Circuits and Systems and Technical Program Chair of the 64th ARFTG, Dec 2004 (Automatic RF Test Group), conference. Prof. Eisenstadt served on the ARFTG Executive Committee, and currently serves on the ISCAS Analog Signal Processing Technical Committee and the Wireless Test Workshop Executive Committee. He has over 25 years experience in IC design and test and has over 150 refereed conference and journal publications, 7 patents and has advised 20 PhD graduates. His book “Microwave Circuit Design Using Mixed-Mode S-parameters,” by William R. Eisenstadt, Bob Stengel and Bruce Thompson was published by Artech House in Spring of 2006.

Abstract

Communications bottlenecks in ICs are requiring hundreds to thousands of pad connections in state-of-the-art ICs. High performance I/O circuits are critical in moving Gbits of data in high performance microprocessor, memory, DSP and communication circuits and controlling IC package in pin count. This tutorial reviews circuits and architecture of high performance I/O that are employed in high performance I/O. Tradeoffs and issues in circuit performance, packages, crosstalk, power and speed are addressed. Example circuits to test 10 I/O channels in packages and boards are presented.