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Prof. William EISENSTADT, University of Florida Dept. of Electrical and Computer Eng, Gainesville, FL, USA

Theme: Progress in On-Chip Microwave/Millimeterwave ICTest
Date: July 1st, 2011 (Friday) - 11:00, TIMA Laboratory, room T312


William R. Eisenstadt (SM92) received the B.S., M.S., and Ph.D. degrees in Electrical Engineering from Stanford University, Stanford, CA, in 1979, 1981, and 1986. In 1984, he joined the faculty of the University of Florida, Gainesville, FL, where he is now a Professor. His research focuses on mixed-signal/RF embedded IC testing, high-speed I/O characterization, BIST, and differential s- parameter characterization of integrated circuit devices, packages, and interconnect. He was Technical Program Co-Chair of the 7th, 6th 5th and 4th Workshops on Test of Wireless Circuits and Systems and Technical Program Chair of the 64th ARFTG, Dec 2004 (Automatic RF Test Group), conference. Prof. Eisenstadt served on the ARFTG Executive Committee, and currently serves on the ISCAS Analog Signal Processing Technical Committee and the Wireless Test Workshop Executive Committee. He has over 25 years experience in IC design and test and has over 150 refereed conference and journal publications, 7 patents and has advised 20 PhD graduates. His book Microwave Circuit Design Using Mixed-Mode S-parameters, by William R. Eisenstadt, Bob Stengel and Bruce Thompson was published by Artech House in Spring of 2006.


Prof. Eisenstadt leads embedded microwave/millimeter wave test research at the University of Florida. The work is focused on building and verifying on-chip test sub- circuits between 1 GHz and 100 GHz and in demonstrating novel GHz circuit concepts in the embedded RF/microwave test area. In prior years, example microwave ICs have been realized that measure gain and phase, sample signals and measure power. This years work has developed small ICs, which implement GHz measurements of complicated S- parameters, characterize differential signals, and phase noise as well as perform broadband microwave power control. The embedded test circuits may become essential in low cost production IC test with the development of millimeter wave ICs with arrays of sensors and high wireless circuit integration levels.