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Proceedings on Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP'2001), Cannes - Mandelieu, France, April 25-27, 2001

Author(s): B. Courtois, J.M. Karam, J.A. Walker, S.P. Levitan, K. Markus, A.A.O. Tay

Publisher: TIMA Laboratory, 46 avenue Félix Viallet, 38031 Grenoble Cedex

Pages: 556 pages

This Symposium will be a follow-up to the very successful issues held in 1999 and 2000 in Paris. This series of Symposia is a unique single-meeting event expressly planned to bring together participants interested in manufacturing microstructures and participants interested in design tools to facilitate the conception of these microstructures. Again, a special emphasis will be put on the very crucial needs of MEMS/MOEMS in terms of packaging solutions. The goal of the Symposium is to provide a forum for in-depth investigations and interdisciplinary discussions involving design, modeling, testing, micromachining, microfabrication, integration and packaging of structures, devices and systems.