Architectures and Methods for Resilient Systems
since 2015

Research topics

photo AMfoRS

The AMfoRS team targets crucial challenges regarding resilient integrated systems. Our goal is twofold: guarantee that systems will not behave unexpectedly and ensure a substantial level of robustness and security. Our work aims at increasing the synergies between verification technologies and activities on the design and validation of reliable, safe and secure integrated systems, with a focus on digital parts.
The expected outcomes of our research include methods, tools and hardware blocks necessary to justify trust in increasingly complex integrated systems and even cyber-physical systems.
The team takes part in several scientific challenges identified not only at the laboratory level, but also in the Research "poles" of University Grenoble-Alpes (especially the MSTIC pole) and more generally at the national level (French strategic directions) and international level (in particular European H2020 priorities).

Last publications

Galy P., De Conti L., Delahaye G., Anghel L., Topology and design investigation on thin film silicon BIMOS device for ESD protection in FD-SOI technology, Microelectronics Reliability, Ed. Elsevier, Vol. , DOI: 10.1016/j.microrel.2019.06.069, 2019
Anghel L., Shah R., Cacho F., On-Chip Ageing Monitoring and System Adaptation, Ageing of Integrated Circuits: Causes, Effects and Mitigation TechniquesOn-Chip Ageing Monitoring and System Adaptation, B. Halak (Eds.) , Ed. , pp. 149-180, DOI: 10.1007/978-3-030-23781-3_6, 2019
Damljanovic A., Jutman A., Portolan M., Sanchez E., Squillero G., Tsertov A., Simulation-based Equivalence Checking between IEEE 1687 ICL and RTL, International Test Conference (ITC 2019), Washington DC, UNITED STATES, 2019
Shah A., Cacho F., Anghel L., Aging Investigation of Digital Circuits using In-Situ Monitors, IEEE International Integrated Reliability Workshop (IIRW 2019), Stanford Sierra, Fallen Leaf Lake, UNITED STATES, 2019
Vatajelu I., Di Natale G., High-Entropy STT-MTJ-based TRNG, IEEE Transactions on Very Large Scale Integration (VLSI) Systems , Ed. IEEE, Vol. , DOI: 10.1109/TVLSI.2018.2879439, 2019
Annual activity report